Product Description

Introduction

This section of ceramic circuit board design concept is to supply LED module plant-specific, can be directly packaged chips directly Wire bonding on the system board, because the ceramic heat with excellent results, but also make your LED brighterlonger life

Product:

Al2O3-Ceramic System Substrate

AlN-Ceramic System Substrate

Specification:

Transmit heat coefficient : Al2O3- 23~27W/mk , AlN- 170~240W/mk

Palting:Ag , Ti , Au

Size: Plasticity is high, according to partner needs to do a variety

Thickness:0.38mm , 0.5mm, 0.635mm , 1mm

Load power:27W or Big high power

Payment Terms︰ TT