Integrated Ceramic circuit board

Ceramic substrate design concept of this section is to enable high power, small size, high brightness LED designed for use in the development of this section to replace the advantages of the system board, LED directly to the multi-chip package in the abovestars, and then by the second Optical lens more compact size make the product sizeand your area of ​​LED lighting products reduced, reduced materials, system cost, the cost of replacing the human assembly, packaging allows you to more quickly anddirectly to the chip Wire bonding to the substrate, plus The use of ceramic thermaleffect is excellent, even make your LED brighter longer life.

This product for the high-power LED package, such as: LED lights

Product:

Al2O3(3x3)- COB The thin film porcelain Ceramic Substrate

Al2O3(5X5)- COB The thin film porcelain Ceramic Substrate

AlN(7X7)-COB The thin film porcelain Ceramic Substrate

AlN(10X10)-COB The thin film porcelain Ceramic Substrate

Specification:

Transmit heat coefficient:Al2 O3- 21~23W/mk , AlN - 170~230W/mk

Palting: Au and Ag

Size:10mmx10mm(3x3) , 25mmx22mm(5x5) , 28mmx28mm(7x7) , 32mmx32mm(10x10)

Thickness:1mm~1.2mm

Load power:5 W~100 W